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dc.contributor.authorBeltrán-Pitarch, Braulio
dc.contributor.authorGarcía-Cañadas, Jorge
dc.date.accessioned2022-01-20T08:13:21Z
dc.date.available2022-01-20T08:13:21Z
dc.date.issued2021-11-23
dc.identifier.citationBeltrán-Pitarch B; García-Cañadas J. Impedance Spectroscopy Analysis of Thermoelectric Modules Fabricated with Metallic Outer External Layers. ACS Appl. Electron. Mater. 2021, 3, 11, 4803–4808. doi:10.1021/acsaelm.1c00670ca_CA
dc.identifier.issn2637-6113
dc.identifier.urihttp://hdl.handle.net/10234/196499
dc.description.abstractIn recent years, thermoelectric (TE) devices have been used in several refrigeration applications and have gained attention for energy generation. To continue the development of devices with higher efficiency, it is necessary not only to characterize their materials but also to optimize device parameters (e.g., thermal contacts). One attempt to increase the efficiency at the device level consists of the replacement of the typical ceramic layers in TE modules by metallic plates, which have higher thermal conductivity. However, this alternative device design requires the use of a very thin electrical insulating layer between the metallic strips that connect the TE legs and the outer external layers, which introduces an additional thermal resistance. Impedance spectroscopy has been proved to be useful to achieve a detailed characterization of TE modules, being even capable to determine the internal thermal contact resistances of the device. For this reason, we use here the impedance method to analyze the device physics of these TE modules with outer metallic plates. We show for the first time that the impedance technique is able to quantify the thermal contact resistances between the metallic strips and the outer layers, which is very challenging for other techniques. Finally, we discuss from our analysis the prospects of using TE modules with external metallic plates.ca_CA
dc.description.sponsorShipFunding for open access charge: CRUE-Universitat Jaume I
dc.format.extent6 p.ca_CA
dc.format.mimetypeapplication/pdfca_CA
dc.language.isoengca_CA
dc.publisherAmerican Chemical Societyca_CA
dc.relation.isPartOfACS Applied Electronic Materials, 2021, vol. 3, no 11ca_CA
dc.rights.urihttp://creativecommons.org/licenses/by-sa/4.0/ca_CA
dc.subjectpeltier deviceca_CA
dc.subjectfrequency domainca_CA
dc.subjectthermal contact conductanceca_CA
dc.subjectthermal interfaceca_CA
dc.subjectmetallic layerca_CA
dc.titleImpedance Spectroscopy Analysis of Thermoelectric Modules Fabricated with Metallic Outer External Layersca_CA
dc.typeinfo:eu-repo/semantics/articleca_CA
dc.identifier.doihttps://doi.org/10.1021/acsaelm.1c00670
dc.rights.accessRightsinfo:eu-repo/semantics/openAccessca_CA
dc.relation.publisherVersionhttps://pubs.acs.org/doi/abs/10.1021/acsaelm.1c00670ca_CA
dc.type.versioninfo:eu-repo/semantics/publishedVersionca_CA
project.funder.nameAgencia Estatal de Investigaciónca_CA
project.funder.nameUniversitat Jaume Ica_CA
project.funder.nameGeneralitat Valencianaca_CA
oaire.awardNumberRYC-2013-13970ca_CA
oaire.awardNumberUJI-B2019-50ca_CA
oaire.awardNumberACIF/2018/233ca_CA


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