Impedance Spectroscopy Analysis of Thermoelectric Modules Fabricated with Metallic Outer External Layers
View/ Open
Metadata
Show full item recordcomunitat-uji-handle:10234/9
comunitat-uji-handle2:10234/7034
comunitat-uji-handle3:10234/8619
comunitat-uji-handle4:
INVESTIGACIONMetadata
Title
Impedance Spectroscopy Analysis of Thermoelectric Modules Fabricated with Metallic Outer External LayersDate
2021-11-23Publisher
American Chemical SocietyISSN
2637-6113Bibliographic citation
Beltrán-Pitarch B; García-Cañadas J. Impedance Spectroscopy Analysis of Thermoelectric Modules Fabricated with Metallic Outer External Layers. ACS Appl. Electron. Mater. 2021, 3, 11, 4803–4808. doi:10.1021/acsaelm.1c00670Type
info:eu-repo/semantics/articlePublisher version
https://pubs.acs.org/doi/abs/10.1021/acsaelm.1c00670Version
info:eu-repo/semantics/publishedVersionSubject
Abstract
In recent years, thermoelectric (TE) devices have been used in several refrigeration applications and have gained attention for energy generation. To continue the development of devices with higher efficiency, it is ... [+]
In recent years, thermoelectric (TE) devices have been used in several refrigeration applications and have gained attention for energy generation. To continue the development of devices with higher efficiency, it is necessary not only to characterize their materials but also to optimize device parameters (e.g., thermal contacts). One attempt to increase the efficiency at the device level consists of the replacement of the typical ceramic layers in TE modules by metallic plates, which have higher thermal conductivity. However, this alternative device design requires the use of a very thin electrical insulating layer between the metallic strips that connect the TE legs and the outer external layers, which introduces an additional thermal resistance. Impedance spectroscopy has been proved to be useful to achieve a detailed characterization of TE modules, being even capable to determine the internal thermal contact resistances of the device. For this reason, we use here the impedance method to analyze the device physics of these TE modules with outer metallic plates. We show for the first time that the impedance technique is able to quantify the thermal contact resistances between the metallic strips and the outer layers, which is very challenging for other techniques. Finally, we discuss from our analysis the prospects of using TE modules with external metallic plates. [-]
Is part of
ACS Applied Electronic Materials, 2021, vol. 3, no 11Funder Name
Agencia Estatal de Investigación | Universitat Jaume I | Generalitat Valenciana
Project code
RYC-2013-13970 | UJI-B2019-50 | ACIF/2018/233
Rights
info:eu-repo/semantics/openAccess
This item appears in the folowing collection(s)
- ESID_Articles [475]