A novel vacuum pressure sensor using a thermoelectric device
View/ Open
Metadata
Show full item recordcomunitat-uji-handle:10234/9
comunitat-uji-handle2:10234/7034
comunitat-uji-handle3:10234/8619
comunitat-uji-handle4:
INVESTIGACIONMetadata
Title
A novel vacuum pressure sensor using a thermoelectric deviceDate
2020Publisher
ElsevierISSN
0042-207X; 1879-2715Bibliographic citation
BELTRÁN-PITARCH, Braulio; GARCÍA-CAÑADAS, Jorge. A novel vacuum pressure sensor using a thermoelectric device. Vacuum, 2020, vol. 172, p. 109088Type
info:eu-repo/semantics/articlePublisher version
https://www.sciencedirect.com/science/article/abs/pii/S0042207X19323425Version
info:eu-repo/semantics/acceptedVersionAbstract
We present the proof-of-concept of a new vacuum pressure sensor based on a new operating principle. The new
sensor is formed by the simple combination of a thermoelectric (TE) module that is contacted at both sides ... [+]
We present the proof-of-concept of a new vacuum pressure sensor based on a new operating principle. The new
sensor is formed by the simple combination of a thermoelectric (TE) module that is contacted at both sides by a
bent copper plate. The vacuum pressure is related to the change in the thermal contact resistance that exists between
the outer ceramic surfaces of the TE module and the copper plate, since heat transfer through the ceramic/copper
interface is found to be influenced by the amount of air present in the interface gaps (vacuum pressure). The
variations of the thermal contact resistance produce a change of the TE module voltage when a fixed current is
applied to it. By monitoring this voltage simultaneously to the response of a commercial pressure sensor at different
vacuum pressures inside a vacuum chamber, a calibration equation was identified, which enables obtaining the
vacuum pressure from the voltage signal. Random errors lower than 10% were found in the 0.1 to 250 mbar range,
which is the pressure range that the sensor can properly sense. This new device is inexpensive, simple to fabricate
and integrate, and benefits from the high stability of TE modules. [-]
Is part of
Vacuum, 2020, vol. 172, p. 109088Investigation project
The authors acknowledge financial support from the Spanish Agencia Estatal de Investigación under the Ramón y Cajal program (RYC-2013-13970), from the Generalitat Valenciana and the European Social Fund under the ACIF program (ACIF/2018/233), from the Universitat Jaume I under the project UJI-A2016-08Rights
info:eu-repo/semantics/openAccess
This item appears in the folowing collection(s)
- ESID_Articles [469]
The following license files are associated with this item: