Measurement of thermal conductivity and thermal diffusivity using a thermoelectric module
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Otros documentos de la autoría: Beltrán-Pitarch, Braulio; Márquez García, Lourdes; Min, Gao; García-Cañadas, Jorge
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Mostrar el registro completo del ítemcomunitat-uji-handle:10234/9
comunitat-uji-handle2:10234/7034
comunitat-uji-handle3:10234/8619
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Título
Measurement of thermal conductivity and thermal diffusivity using a thermoelectric moduleFecha de publicación
2017Editor
IOP Publishing LtdCita bibliográfica
Braulio Beltrán-Pitarch et al 2017 Meas. Sci. Technol. 28 045902Tipo de documento
info:eu-repo/semantics/articleVersión de la editorial
http://iopscience.iop.org/article/10.1088/1361-6501/aa5c30Palabras clave / Materias
Resumen
A proof of concept of using a thermoelectric module to measure both thermal conductivity and thermal diffusivity of bulk
disc samples at room temperature is demonstrated. The method involves the calculation of the ... [+]
A proof of concept of using a thermoelectric module to measure both thermal conductivity and thermal diffusivity of bulk
disc samples at room temperature is demonstrated. The method involves the calculation of the integral area from an
impedance spectrum, which empirically correlates with the thermal properties of the sample through an exponential
relationship. This relationship was obtained employing different reference materials. The impedance spectroscopy
measurements are performed in a very simple setup, comprising a thermoelectric module, which is soldered at its bottom side
to a Cu block (heat sink) and thermally connected with the sample at its top side employing thermal grease. Random and
systematic errors of the method were calculated for the thermal conductivity (18.6 % and 10.9 %, respectively) and thermal
diffusivity (14.2 % for both errors) employing a BCR724 standard reference material. Although errors are somewhat high,
the technique could be useful for screening purposes or high-throughput measurements at its current state. This new method
establishes a new application for thermoelectric modules as thermal properties sensors. It involves the use of a very simple
setup in conjunction with a frequency response analyzer, which provides a low cost alternative to most of currently available
apparatus in the market. In addition, impedance analyzers are reliable and widely spread equipment, which facilities the
sometimes difficult access to thermal conductivity facilities. [-]
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Measurement Science and Technology, Volume 28, Number 4Derechos de acceso
© 2017 IOP Publishing Ltd. This is an author-created, un-copyedited version
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Measurement Science & Technology. IOP Publishing Ltd is not
responsible for any errors or omissions in this
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version is available online at https://doi.org/10.1088/1361-6501/aa5c30
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